Scribe & Break Processing
Introducing a cutting processing method that uses no water and allows for high-speed processing.
"Scribe & Break processing" is a cutting method that utilizes the physical properties of the processed material. It is a dry processing method that does not use water, and it allows for high-speed processing. On the other hand, it is greatly influenced by the material's physical properties (especially crystal orientation), making it challenging to determine the processing conditions. Additionally, the scribe & break technique has been used for a long time as a method for cutting hard and brittle materials like glass. 【Features】 ■ Support for fine processing - Suitable for cutting small chips from thin substrates - Minimal vibration during processing, with little risk of chips flying off ■ Support for curved processing - Capable of processing curves (3D processing) in applications - Laser scribing allows for cutting with even smaller radii *For more details, please refer to the PDF materials or feel free to contact us.
- Company：三星ダイヤモンド工業
- Price：Other
